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Books available for consulting
In our Lab
George Harman, Wire Bonding in Microelectronics,
Second Edition, 1997
Shankara K. Prasad, Advanced Wirebond
Interconnection Technology, 2004
Charles A. Harper, Electronic Packaging
and Interconnection Handbook, Third Edition, 2000
Colin Lea, After CFCs? - Option for
Cleaning Electronics Assemblies, 1992
Johan Liu, Conductive Adhesives for
Electronics Packaging, 1999
Martin Bartholomew, An Engineer's
Handbook of Encapsulation and Underfill Technology, 1999
Ning-Cheng Lee, Reflow Soldering
Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip
Technologies,2001
Patrick D. T. O'Connor, Practical Reliability Engineering, Fourth Edition, 2002
H. Anthony Chan, Accelerated
Stress Testing Handbook, 2001
Allan G. Piersol, Harris' Shock and Vibration Handbook, Sixth
Edition, 2010
In the CERN Library
Gregg K. Hobbs,
Accelerated reliability engineering : HALT and HASS, 2000
Loren D. Lutes,
Random Vibrations, 2004
Useful Links
Packaging Tutorials
The Nordic Electronics Packaging Guideline
Flip Chip Tutorials
Micropackaging Technical Information
Semiconductor Manufacturing
Semiconductor Manufacturing
Reliability Papers
NASA Office of Logic Design
Accelerated Life Testing Reference
HALT & HASS
CERN
CH-1211 Genève 23
Suisse
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