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What is wirebonding?                                                                    

Wirebonding is an electrical interconnect technology developed by microelectronics industry and today used excessively in (solid state) detector construction. It allows to interconnect electronic chips, printed circuit boards, pitch adapters and solid state sensors.

The Wirebonding technique is a solid phase welding process which uses thin wire and a combination of heat, pressure and/or ultrasonic energy.

What types of wirebonding processes exist?                    

Wirebonding process begins by firmly attaching the backside of a chip to a chip carrier using either an organic conductive adhesive or a solder (Die Attach).
The wires then are welded using a special bonding tool (capillary or wedge).

Depending on bonding agent, we can identify three major wirebonding processes:


Wirebonding processes

Pressure

Temperature

Ultrasonic energy

Wire

Pad

Thermocompression

High

300-500 oC

No

Au,

Al, Au

Ultrasonic

Low

25 oC

Yes

Au, Al

Al, Au

Thermosonic

Low

100-150 oC

Yes

Au

Al, Au


 Alternatives to wire bonding                   

Tape Automated Bonding (TAB) uses thin Cu beams instead of wires. The beams are held in place by thin polymer tapes (usually Polyimide) and form a microcable.
The STAR experiment (BNL) and ALICE are employing a form of TAB technology.


Flip chip bonding, often also referred to as bump bonding currently provides the highest connection density. Invented in the mid 1960s, the technology uses bumps (conductive polymers, Indium or solder bumps, microballs) instead of wired to bond the flipped chip to a substrate. In HEP the flip chip technology is so far exclusively used in the construction of Si pixel detectors, where a Si sensor, segmented as area array of individual diodes need to be connected to the readout chip, correspondingly segmented.

The Bondlab is performing exclusively Ultrasonic Wedge Bonding with Aluminum wire.

 




 

    
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