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Equipment
Automatic wire
bonders DELVOTEC G5
The DELVOTEC
G5 (Delvotec) machine
is a fully automatic wedge bonder for
Aluminum wires. Our machines are operated with Al wires of 25 µm diameter.
The accessible work area is 150 x 200 mm, 25 mm in z (vertical).
Die bonder, CAMMAX DB 600
The CAMMAX DB600 (Cammax) allows to
precisely pick and place chips on hybrids. Equipped with a heating work stage,
the device can be used for die gluing by thermo plastic film.
Multifunctional bond pull tester
Dage 4000
The Dage 4000 (Dage) allows to perform wire bond pull tests
in a very controlled and reproducible way, both in destructive and
non-destructive mode. This allows to characterize the bond and so to optimize
the bonding parameters.
Shear testing is an
established destruvtive method for evaluating the solder joint reliability oh
the PCB assembly.
Our
Dage 4000 is capable to provide Die Shear test to 100 kg.
Microscopes
Leica MZ16: (Brochure)
Zoom ratio (16:1)
provides standard magnification
from 7.1x – 115x including 10x eyepiece, 2x
objective
WILD - M3Z:
Stereo Microscope. Zoom ratio (6:1), Zoom Range: 6.5
to 40
with included 10 x eyepiece, 1.5X objective
Olympus SZx7 (Olympus)
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